a process
Name |
a sign |
contents |
Copper-plated
laminate
plate |
¡Ô |
Warehousing
of Copper-plated laminate plate
|
Cutting |
¡Û |
Cutting
warehoused Copper-plated laminate
plate
easy
to print |
N.C
DRILL |
¡Û |
Making
Through Hole with DRILL M/C |
Un-electrolytic
copper plating |
¡Û |
Chemical
copper plating to 2§ thickness
to give inner wall of
drilled hole conductivity |
D/F |
¡Û |
Forming
circuit by exposure and development
using
circuit
formed film after sticking half
hardened Dry Film
fast
to substrate |
PATTERN
plating |
¡Û |
Plating
to above 25§ thickness to surface
where plating resist material
is not applied and Hole wall |
ETCHING |
¡Û |
Removing
unnecessary copper plate other
than
formed
circuit |
Manufacturing
process circuit test |
¡Ô |
Testing
Open short generated during
after ETCHING |
printing |
¡Û |
Applying
insulating ink to parts where
soldering is not needed &
Parts No, Parts sign for printing |
H.A.L |
¡Û |
Making
lead thickness of surface and
hole wall uniform
with
8Kgf/§² Air pressure after depositing
5 sec to 250+/-5¡É
lead
bathtub |
Router
& Press |
¡Û |
Routing
method : Processing outer shape
with Router M/C Punching method
: Processing outer shape with
Press
by
making metallic pattern |
Auto-Check |
¡Þ |
BARE
BOARD Test (Open, Short Auto
test) |
Final
total sorting |
¡Þ |
Test
of whole product to sort as
superior and inferior goods |
Finished
product test |
¡Þ |
Test
to LOT passing final test to
decide whether as
good
or bad |
Packing |
¡Û |
Packing
products in the way to prevent
transformation during delivery
|
Shipping |
¡Ô |
Delivery
of goods to designated place
within the appointed date demanded
by customers |
