manufacturing    process

 

 PHENOL

 section

 

 

 EPOXY

 DOUBLE

 

 

 SILVER

 THROUGH

 HOLE

 

a process Name

a sign

contents

Copper-plated

laminate plate

Warehousing of Copper-plated laminate plate

Cutting

Cutting warehoused Copper-plated laminate plate

easy to print

N.C DRILL

Making Through Hole with DRILL M/C

Un-electrolytic copper plating

Chemical copper plating to 2 thickness to give  inner wall of drilled hole conductivity

D/F

Forming circuit by exposure and development using

circuit formed film after sticking half hardened Dry Film

fast to substrate

PATTERN plating

Plating to above 25 thickness to surface where plating resist material is not applied and Hole wall

ETCHING

Removing unnecessary copper plate other than

formed circuit

Manufacturing process circuit test

Testing Open short generated during after ETCHING

printing

Applying insulating ink to parts where soldering is not needed & Parts No, Parts sign for printing

H.A.L

Making lead thickness of surface and hole wall uniform

with 8Kgf/ Air pressure after depositing 5 sec to 250+/-5

lead bathtub

Router & Press

Routing method : Processing outer shape with Router M/C Punching method : Processing outer shape with Press

                               by making metallic pattern

Auto-Check

BARE BOARD Test (Open, Short Auto test)

Final total sorting

Test of whole product to sort as superior and inferior goods

Finished product test

Test to LOT passing final test to decide whether as

good or bad  

Packing

Packing products in the way to prevent transformation during delivery

Shipping

Delivery of goods to designated place within the appointed date demanded by customers